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    Programming Services Introduction

    Besides specializing in design, manufacturing and marketing of device programmers, HI-LO SYSTEMS established its First Programming Center, located at Neihu Taipei(headqarter), in 2001 to extend its expertise into the field of IC programming services to satisfy the high demands coming from IT and the hand-held device market.

    With powerful support from the HI-LO engineering team and over 200 sets of automated programming systems installed, the HI-LO Programming Centers are able to offer comprehensive and also competitive solutions for device programming, ink / laser marking, taping & reeling, 3D optical lead inspection, baking and dry packing, etc., including special requests of customized device programming and packing.

    Hi-Lo Taipei Programming Center has been ISO 9001 and ISO 14001 certified. Assisted by ERP real-time management control system, all programming processes and operations are under the strictest control. Optimum programming quality, yield and efficiency are sustained at the highest levels. This Programming Center is capable of offering programming services for over 300K units daily. Since we developed the necessary technology ourselves and work with key IC manufacturers at very early stages, HI-LO has already become the most important programming service provider in the market.

    IC Programming
    ·      Support programming for various device types, including MPU/MCU, EPROM, EEPROM, Serial EEPROM, Flash Memory, PLD/CPLD etc.
    ·      Support programming for various device packages, including DIP, SDIP, SOP, MSOP, QSOP, SSOP, TSOP, TSSOP, PLCC, QFP, CASON, QFN, MLP, MLF, BGA, CSP, SOT, DFN etc.
    ·      IC Manufactures?Covering major world-class brands from the U.S., Japan, Taiwan, European countries, etc.
    ·      Programming Systems?Over 50 sets of AT3-300 Series Automated Equipments available to offer > 500K daily capacity of Tray / Tube / Tape IC programming. Strict process & operation control to ensure service quality and yield.

    Ink / Laser Marking
    ·      Support alphanumerical marking for up to 4 letters according to customer request.
    ·      Over 10 sets of Laser/Auto Markers available to offer > 500K daily marking capacity. Various marking colors available according to customer request.

    Taping & Reeling
    ·      Offer inventory of various carrier and cover tapes for a wide variety of packages. Perform visual inspection before taping & reeling. Customized carrier tapes can be obtained to meet specific requirements.

    3D Optical Lead Inspection
    ·      SOP Package
    ·      TSOP Package
    ·      BGA Package
    ·      QFN & QFP Package

    Baking & Dry Packing
    ·      Baking for data retention test is available according to customer request. Offer pre-baking option before dry packing according to customer request. Dry packing service available for Tray devices and Tape & Reel packages.

    ·      Develop dedicated programming methodology for customized products and packages. Offer total solution for mass production of device programming.

    • Standard IC device programming.
    • Tape and Reeling.
    • Baking
    • Laser Marking
    • Lead Scanning (for Automotive)
      • True 3D lead scan, BGA ball checking. 3D coplanarity check.
    • Serialization
      • Sequential Serial Data programming
      • Random Serial Data(Data merge)
    • First article
      • Hardware/Software version control.
    • Proprietary Programming Hardware and Software
      • WLCSP, proprietary form factor customization
      • Trace data logging(collect via LAN)
    • Customized Production Process
      • Thin fine pitch package
      • Customer’s source code security assurance
      • Data encryption/decryption(RSA-2048)